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End face through-hole substrate

Contributing to the miniaturization of device substrates and module substrates, as well as the improvement of implementation density on motherboards!

We would like to introduce our "Edge Through-Hole PCB" that we handle. It enables high-density mounting, significantly contributing to the miniaturization of device boards and module boards, as well as improving the mounting density of motherboards. Additionally, we have established mass production technology for narrow-pitch edge through-holes. Please feel free to contact us when you need assistance. 【Features】 ■ Enables high-density mounting ■ Allows for miniaturization of device boards and module boards ■ Significantly contributes to improving the mounting density of motherboards *For more details, please refer to the PDF document or feel free to contact us.